From October 17 to 20, 2024, the World Intelligent Connected Vehicle Congress was held at Beijing Yizhuang, Northern Renchuang International Exhibition Center. This premier event not only highlighted cutting-edge automotive technologies but also officially unveiled the “2024 Automotive Chip Innovation Showcase” by China Science & Technology Information, offering the industry a timely view of the latest technological trends and market demands.

Automotive chips serve as the “brain” of intelligent connected vehicles, managing a wide range of tasks from powertrain control and autonomous driving to in-car infotainment systems. In recent years, with the global technological revolution accelerating, automotive chips have evolved from simple electronic controllers into highly integrated intelligent computing platforms, driving the continuous advancement of vehicle intelligence and connectivity. The 2024 innovations stand out for their sophistication and practical application.

Among the typical cases, domestic automotive chips demonstrate remarkable R&D capabilities and deployment potential. High-performance AI computing chips used in advanced driver-assistance systems (ADAS) enable vehicles to perceive and respond to complex traffic scenarios in real time, greatly enhancing driving safety and efficiency. Power semiconductor chips designed for electrification optimize energy management and thermal control, significantly improving EV range and system reliability. In-car infotainment chips enrich human-machine interaction through full-touch interfaces, voice assistants, and multi-screen collaboration, providing an immersive smart cockpit experience.

Furthermore, the rapid development of domestic software and operating systems has become a highlight of 2024 automotive chip innovation. Widespread adoption of homegrown OS in vehicle electronic architectures enhances chip integration and adaptability while ensuring information security and data privacy. Ecosystem integration encourages more companies to participate in chip design, algorithm optimization, and system verification, forming a comprehensive industry chain covering design, manufacturing, testing, and application.

These innovations not only meet the growing domestic demand for high-performance, intelligent vehicles but also demonstrate China’s rising competitiveness in the global automotive chip market. From ADAS to new energy vehicles, from smart cockpits to vehicle networking, each technological advancement continues to redefine industry standards and user experiences. The 2024 automotive chip innovation achievements mark a significant milestone in China establishing a leading position in the global intelligent connected vehicle technology arena.

Looking forward, as autonomous driving, vehicle networking, smart cities, and new energy technologies converge, automotive chips will become increasingly critical. Whether enhancing vehicle safety, energy efficiency, or intelligent user interaction, chips will continue to drive the transformation and upgrading of the automotive industry. The innovations of 2024 showcase not only technical prowess but also a clear roadmap for the future—smart mobility is no longer a concept; it is becoming reality.

Highly reliable automotive-grade eMMC storage chips and solutions

Deyiwei’s SiliconGo brand automotive-grade eMMC memory series is specifically designed for the automotive industry. Equipped with Deyiwei’s proprietary controller chip, these products support eMMC 5.1 data transfer mode, offering excellent read and write performance and responsiveness. They have passed the AEC-Q100 Grade 2 automotive testing standards and ensure stable operation in extreme operating temperatures ranging from -40°C to +105°C. Available in a variety of capacities (4GB/8GB/16GB/32GB/64GB/128GB), they meet diverse customer storage needs.

Deyiwei’s automotive-grade eMMC, as an embedded memory chip, features a small package size, high reliability, excellent consistency, and extended wear life, making it an ideal choice for pre-installed automotive applications. It is widely used in digital instrument clusters, T-Boxes, ADAS, smart cockpits, in-vehicle infotainment systems, event recorders, and other systems. It has been widely adopted by major automakers such as Dongfeng, Changan New Energy, SAIC Maxus, and Shaanxi Automobile.

Deyiwei continues to engage in in-depth technical exchanges and collaborations with numerous domestic automakers and Tier 1 manufacturers, helping them develop storage solutions that truly meet automotive needs and providing strong support for the continued development of the domestic automotive industry.

Domestic Automotive Ethernet Switch Chip — TAS2010

Beijing Guoke Tianxun Technology Co., Ltd. independently developed the domestically produced automotive-grade TSN switch chip, the TAS2010. It has been installed on 33 FAW Hongqi prototype verification vehicles and has passed all tests and assessments, including a one million-kilometer road test. This TSN switch chip is also verified to meet automotive-grade application requirements and specifications. Guoke Tianxun has established partnerships with numerous industry partners, including renowned automakers such as FAW, Changan, GAC, and Dongfeng, as well as several well-known Tier 1 companies. Currently, it is jointly developing gateways or domain controllers with several OEMs and is collaborating with several automakers on OPC projects for the next-generation real-time Ethernet architecture.

The TAS2010 passed AEC-Q100 Grade 2 reliability testing in April 2023 and successfully obtained functional safety certification for road vehicles in May of the same year. During the same period, Goke Tianxun actively cooperated with OEMs in testing and verification of mass-produced models, securing market opportunities with multiple production models from multiple automakers. It anticipates deployment on production vehicles in the first half of 2025. Furthermore, in areas such as specialized vehicles, Goke Tianxun, leveraging its industry and technological advantages, is actively collaborating with relevant customers on the onboard verification of their TSN switch chips. These specialized vehicles will also be equipped with a complete solution based on this TSN switch chip, offering significant potential for application.

Black Sesame Intelligent Wudang® C1296

The Black Sesame Intelligent Wudang® C1296 is a high-performance, highly integrated in-vehicle cross-domain computing chip. Manufactured using a 7nm automotive-grade process, it features an automotive-grade, high-performance CPU. It is the industry’s first high-performance, highly integrated cross-domain converged computing chip for intelligent vehicles. It boasts GPU, DSP, and real-time processing capabilities, and features a carefully designed cross-domain architecture combining hard isolation and a hypervisor. With its proprietary NPU and ISP at its core, it offers a rich array of sensor interfaces, high- and low-speed vehicle interfaces, various display outputs, and 10 Gigabit Ethernet. It fully supports the cross-domain convergence of intelligent cockpits, intelligent driving, and intelligent gateways, meeting the needs of various stages of vehicle electronic and electrical architecture evolution.

Since its release, the Wudang C1200 family has entered full commercialization. The C1200 family includes the C1296, a single-chip chip that supports multi-domain integration of cockpit, driving, and parking control, and the C1236, a single-chip NOA integrated driving and parking chip for advanced intelligent driving. Based on the C1200 family, Heizhima Intelligent has reached cooperation with many customers, including OEMs and Tier 1s such as FAW Hongqi, Wind River, Junlian Zhiji, and Banma Zhixing.

China Resources Microelectronics Automotive Headlight Beam Position Controller CS3629

This project product is an automotive headlight beam position motor driver chip used to control the raising and lowering of headlight beams. It has achieved AEC-Q100 automotive certification. It offers high precision and reliability, a wide operating voltage range, high drive current, and lower power consumption than comparable products. It also includes comprehensive protection features such as overvoltage protection, thermal protection, wire breakage, and short-circuit protection. This product is used for onboard headlight position control in the automotive market and has achieved cumulative sales of over 7 million units. Cumulative sales are expected to exceed 10 million units by the end of 2024.

China Resources Microelectronics holds full intellectual property rights for the key technologies of this product. Through continuous independent innovation and research and development, the company has mastered key technologies and improved its technical performance. By enhancing user experience and expanding its service scope, it has effectively driven the development of the automotive electronics industry upstream and downstream, playing a positive role in promoting technological iteration and industrial upgrading within the automotive electronics industry chain.

R-LinC: 16Gbps High-Performance Automotive SerDes Chip

R-LinC, a 16Gbps high-performance automotive SerDes chip, is primarily suitable for applications such as in-vehicle HD camera transmission. It supports transmission rates of 16Gbps to 1.6Gbps, a transmission distance of up to 15 meters, and insertion loss compensation exceeding 30dB. Its speed and process technology are currently one to two generations ahead of its competitors. A single R-LinC chip can connect to two 8MP cameras, reducing the number of chips, wiring harnesses, and connectors, significantly lowering system costs. Furthermore, the R-LinC deserializer chip supports 6-way aggregation and forwarding, reducing the number of deserializer and forwarder chips, further reducing system costs.

Automotive camera SerDes chips compliant with the China Automotive Standardization Administration’s HSMT standard.

As a chip design company and a member of the drafting committee of the China Automotive Standardization Administration’s “Technical Requirements and Test Methods for Automotive Wired High-Speed Media Transmission (HSMT)” standard, Ruifa Technology will begin mass production of the HSMT series of automotive video transmission chips in 2023. These chips include the NS6012 serializer and the NS6603 deserializer. The NS6012 converts MIPI CSI signals from automotive sensor chips into high-speed wired serial signals compliant with the HSMT standard. The NS6603 receives four serial HSMT signals for image stitching and connects to the automotive SoC via the MIPI DPHY/CPHY interface. This enables long-distance transmission of video data and bidirectional control data between the camera and the SoC. This product is suitable for autonomous driving, advanced driver assistance systems, front-view camera systems, surround view systems, driver monitoring systems, and automatic parking assistance systems. This product has obtained a third-party AEC-Q100 certification report and boasts an automotive-grade quality management assurance system, providing in-vehicle chip solutions and comprehensive support. This solution utilizes a fully domestic supply chain to ensure supply and meet domestic substitution requirements. This product offers several advantages over international competitors: First, it complies with the HSMT standard protocol; second, it supports powerful RS-FEC forward error correction and low-latency physical layer data retransmission, exhibits excellent anti-interference capabilities, and demonstrates excellent EMC and BCI test results in automotive environments; third, it offers enhanced equalization performance and longer transmission distances; fourth, it supports cable fault location detection in PoC scenarios; and fifth, it has obtained ISO26262 Functional Safety ASIL D process certification and ISO26262 Functional Safety ASIL B product certification from TUV Rheinland, a globally recognized functional safety certification body.

1200V 8mΩ SiC MOSFET

The AMS1200008X-ASATH (1200V 8mΩ TO247-4L Plus) offers the lowest on-resistance and highest rated current in the company’s 1200V MOSFET platform. Utilizing advanced SiC MOSFET technology, it offers low on-resistance, low switching losses, an operating temperature up to 175°C, and features ultra-fast reverse recovery time and a robust intrinsic body diode. The product offers excellent electrical performance, including a low turn-on voltage and an actual rated voltage far exceeding the platform level. Suitable for high-frequency circuits, it reduces overall system size, improves efficiency, and significantly increases switching frequency. It has been widely used in motor drives, circuit breakers, uninterruptible power supplies, and photovoltaic inverters. It utilizes RoHS-compliant components and meets AEC-Q101 standards for automotive applications.

KD6610

The KD6610 is a network communication chip specifically developed for the automotive sector. Following the KD6630, a fully autonomous, controllable switch chip, it is the second automotive-grade chip for low- and mid-range passenger vehicles. The KD6610 supports L2/L3 unicast and multicast features, with a total switching performance of 8.5 Gbps across the chip’s service interfaces, and 4.5 Gbps under typical conditions. Regarding Ethernet service interfaces, the chip includes one 100BASE-TX port, one RGMII/MII/RMII port, four built-in 100BASE-T1 ports, and two SGMII/1000BASE-X ports (one of which has a MAC capable of RGMII/MII/RMII). The SerDes also supports multiplexing of one 5GBASE-X/2.5GBASE-X/SGMI1/10ASE-X interface with a PCIe 2.0 interface. It supports full-line-rate 802.1ad and 802.10 Layer 2 Ethernet switching and Layer 3 IP routing on all Ethernet ports. It also supports a 4096-entry MAC address table and 4095 VLANs. It supports 512 upstream ACL policies and 256 downstream ACL policies for complex packet classification and Ethernet security processing. Each port has eight priority queues for both upstream and downstream traffic, supporting rate limiting, traffic shaping, queue priority scheduling, and DWR scheduling. For sensitive networks, it supports IEEE 802.1AS, IEEE 802.1CB, IEEE 802.1Qci, IEEE 802.1Qav, and IEEE 802.1Qbv, as well as three 802.1AS clock domains. In terms of management interfaces, the embedded high-performance CPU (CK810) can implement localized CPU management solutions through interfaces such as QSPI, GPI0, I2C, and UART. It provides one SMI Master interface for managing the external Ethernet PHY chip, supports the PCIe2.0 (EP) interface, and is used for external CPU management chips and sending and receiving messages. It provides one SPI Slave interface for external MCU/CPU configuration management. The chip integrates an internal power management PWU module for power-off control of the CMS subsystem. The integrated 100BASE-T1 PHY supports the TC10 feature.

Automotive-Grade Boost/Flyback/SEPIC Power Conversion Chip TPQ5055Q

With the increasing adoption of electrification and intelligent vehicles, the TPQ5055Q and TPQ50517Q product series offer comprehensive functionality and flexibility, greatly satisfying the power supply needs of boost, SEPIC, and flyback topologies for the three-electric systems, ADAS, and cockpit systems in new energy vehicles (NEVs), contributing to the development of new energy vehicles in China. Product advantages include: First, dual-frequency jittering provides superior EMI performance; Second, support for multiple Boost/Flyback/

SEPIC topologies; and Third, flexible selection of external MOSFETs based on output power. Application scenarios include NEV three-electric systems, ADAS, and cockpit systems.

Core of the Cabin – X9 Series Smart Cockpit Chip

SemiChip’s Core of the Cabin X9 series processors are automotive-grade chips designed specifically for next-generation automotive electronic cockpits. They integrate a high-performance CPU, GPU, AI accelerator, video processor, and a rich set of in-vehicle scenario communication interfaces, audio and video input/output, and storage interfaces, meeting the powerful computing and communication capabilities required for next-generation automotive electronic cockpit applications. Furthermore, the entire X9 series features a built-in high-performance HSM module and an independent safety island, meeting ASIL B functional safety standards and enabling applications with even more stringent safety requirements. With its X9 Core of the Cabin series, SemiChip comprehensively addresses cockpit processor needs across all generations, encompassing 3D instrumentation, IVI, cockpit domain control, cabin-parking integration, cabin-driving-parking integration, and central computing platforms, from entry-level to flagship cockpit applications. The company is actively leading the development of AI cockpit products. The X9 series has become the mainstream choice for China’s automotive-grade smart cockpit chips, having completed mass production and shipment of over 4 million units. It has rich mass production experience and a mature ecosystem, covering more than 40 mainstream models. Customers include SAIC, Chery, Changan, GAC, BAIC, Dongfeng Nissan, Dongfeng Honda, etc.

Automotive-Grade Smart Cockpit Chip “Dragon Eagle One”

In 2021, CoreEngine Technology launched the “Dragon Eagle One” 7nm smart cockpit chip. In 2023, the first year of mass production, “Dragon Eagle One” will exceed 200,000 units, with shipments expected to reach one million in 2024. Currently, the chip has entered mass production and is in production for over 20 mainstream models, including the Lynk & Co 06, 07, and 08 series, the Geely Galaxy E5, the Geely all-electric pickup truck, and the FAW Hongqi. Based on the high-computing power of “Dragon Eagle One,” CoreEngine has developed a single-chip solution that integrates the smart cockpit, automated parking, and assisted driving. This solution promises 20% to 30% cost savings compared to traditional solutions, effectively addressing the pain points of automakers in reducing costs and increasing efficiency.

Z20K11xN Series with Fully Automotive-Qualified Domestic Supply Chain

The company will officially launch the Z20K11xN series of products based on the automotive-qualified 40nm process in 2024. All wafer production, packaging, and testing processes utilize domestic supply chains, providing domestically produced MCUs for automotive applications. The Z20K11xN is an enhanced microcontroller based on SMIC’s automotive-qualified 40nm Cortex-M0+ process. Developed using ASIL-D functional safety hardware design and software development processes, the Z20K11xN product series complies with AEC-Q100 specifications and is primarily targeted at automotive body electronics applications such as power liftgates, HVAC systems, new energy applications, chassis parking/braking, low-power motor control, and digital keys. The Z20K11xN series offers up to two physically independent, high-capacity flash memories (256KB program memory + 128KB data memory, with the 128KB data memory also used for program storage). A rich set of on-chip peripherals provides flexible expansion capabilities, including up to 16 DMA channels for data transfer, four UARTs supporting LIN Frames, three SPI channels, two I2C channels, and two CAN/CAN-FD channels. In terms of application support, the Z20K11xN supports development and debugging environments such as GNU, IAR, and KEIL, allowing customers to develop software using an SDK. This product targets a wide range of applications, covering a wide range of fields. These include power seats, power windows, power sunroofs, power tailgates, and door modules; air conditioning and lighting control; chassis control; and brake control. New energy applications such as PTC, AC/DC, and DC/DC are also targeted, as is brushless motor control. Furthermore, other small and medium-sized CAN node applications are also included.

Automotive-Grade Fourth-Generation Low-Power Dynamic Random Access Memory (LPDDR4) Model SCB11N8G322BF-04ZA2

The SCB11N8G322BF-04ZA2 is Xi’an Unigroup Guoxin’s proprietary LPDDR4 DRAM (fourth-generation low-power synchronous dynamic random access memory). Designed to meet the performance and reliability requirements of intelligent and networked automotive electronic systems, it offers high bandwidth and low power consumption, providing strong support for advanced driver assistance systems and in-vehicle infotainment systems. It also boasts high reliability, adaptable to extreme climate conditions, ensuring high reliability and long-term stable operation in automotive environments. Through its innovative high-speed interface and low-power design, the product boasts a speed of 4266Mbps, significantly improving power consumption and chip area compared to the previous generation. A comprehensive reliability verification and testing program ensures compliance with automotive Grade 2 requirements. This product has completed R&D verification and AEC-Q100 certification and has now entered mass production, providing an ideal memory solution for automotive electronic control systems such as lidar, front-view cameras, head-up displays, LCD instruments, vehicle dynamic control systems, and driver monitoring systems.