Multi-GNSS BeiDou-3 Baseband Chip with Global Navigation Support – 40nm BGA Package for High-Precision Positioning
HBP2020
The HBP2020 is a high-performance BeiDou-3 (BDS-3) dedicated baseband chip developed by WalliSemi, designed to deliver cutting-edge navigation and communication capabilities. Built on an advanced 40nm process technology, this chip supports multi-frequency signals across global satellite systems, including BDS, GPS, GLONASS, Galileo, and RDSS, ensuring exceptional accuracy and reliability for diverse applications.
Specifications
Key features include:
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Comprehensive frequency support for enhanced positioning precision in challenging environments.
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Versatile interfaces (UART, SPI, I2C, GPIO) for seamless integration with peripheral devices.
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Compact BGA package (14mm × 14mm × 1.11mm), ideal for space-constrained designs.
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Wide operating temperature range (-40℃ to +85℃), making it suitable for industrial, automotive, and outdoor applications.
With its robust performance and future-ready architecture, the HBP2020 embodies the vision of “Intelligent Technology, Core to the Future”, positioning itself as a cornerstone for next-generation navigation solutions.
| Model | HBP2020 |
| Supported Frequencies | BDS:B1/B3/B1C/B1A/B3A/B3AE/B3Q/B2a/B2b/SBASL1/SBASL5 GPS: L1CA/L1C/L2C/L5 GLONASS: L1/L2 Galileo: E1/E5a/E5b RDSS: S1/S2/C, S2C_d/S2C_p, S2A, Lf0~Lf5 |
| Process Technology | 40nm |
| Navigation & Communication Interfaces | UART, SPI, I2C, GPIO |
| Package Type | BGA |
| Dimensions | 14mm x 14mm x 1.11mm |
| Operating Temperature | -40℃ to +85℃ |