High-Precision BeiDou-3 Civilian Baseband Chip – Multi-GNSS Support with 40nm BGA Package
HTG001
The HTG001 is a civilian-grade high-precision BeiDou-3 (BDS-3) baseband chip developed by WalliSemi, engineered to deliver exceptional navigation accuracy for commercial applications. Fabricated using 40nm process technology, this advanced IC supports comprehensive multi-GNSS frequency coverage including BDS, GPS, GLONASS, Galileo, and RDSS systems, making it ideal for demanding positioning requirements.
Specifications
Key technical advantages:
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Multi-constellation compatibility ensures reliable positioning across all major global navigation systems
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Compact BGA package (14×14×1.11mm) enables integration in space-sensitive designs
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Industrial-grade robustness with an operating range of -40℃ to +85℃
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Flexible interface options (UART/SPI/I2C/GPIO) for system integration
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Optimized for civilian applications requiring high-precision location services
This chip represents WalliSemi’s commitment to “Intelligent Technology, Core to the Future”, providing a cost-effective solution for precision navigation in IoT devices, automotive systems, and industrial tracking applications. Its superior signal processing capabilities and multi-frequency support make it particularly suitable for emerging markets requiring centimeter-level accuracy.
| Model | HTG001 |
| Supported Frequencies | BDS:B1I/B3I/B1C/B1A/B3A/B3AE/B3Q/B2a/B2b/SBASL1/SBASL5 GPS: L1A/L1C/L2C/L5 GLONASS: L1/L2 Galileo: E1/E5a/E5b RDSS: S1/S2C_d/S2C_p/S2A/Lf0~Lf5 |
| Process Technology | 40nm |
| Navigation & Communication Interfaces | UART, SPI, I2C, GPIO |
| Package Type | BGA |
| Dimensions | 14mm × 14mm × 1.11mm |
| Operating Temperature | -40℃ to +85℃ |