WASC-1 Civilian Baseband Processor Chip – Satellite Mobile Communication with Multi-GNSS Support
HTD1001
The WASC1001 is a civilian-grade baseband processor chip developed by WalliSemi specifically designed for the WASC-1 satellite mobile communication system. Built with advanced 40nm process technology, this versatile IC integrates both satellite communication capabilities and multi-GNSS positioning support (including BDS B1 and GPS L1), making it ideal for remote communication and navigation applications.
Specifications
Key technical features:
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WASC-1 satellite mobile communication support for reliable connectivity in remote areas
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Multi-GNSS compatibility (BDS B1 and GPS L1) for enhanced positioning services
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Rich interface portfolio including SPI, UART, GPIO, I2C, I2S, SD, PCM, and SIM interfaces
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Compact LFBGA package (13×13×3mm) optimized for space-constrained designs
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Wide temperature operation (-40℃ to +85℃) suitable for harsh environments
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Low-power 40nm design for energy-efficient operation
This processor chip embodies WalliSemi’s vision of “Intelligent Technology, Core to the Future”, providing a complete solution for satellite communication terminals, emergency communication devices, and remote monitoring systems. Its unique combination of satellite communication and GNSS capabilities makes it particularly valuable for applications requiring reliable connectivity beyond terrestrial network coverage.
| Model | WASC1001 |
| Supported Modes | WASC-1 satellite mobile communication mode, BDS B1, GPS L1 |
| Process Technology | 40nm |
| Standard Communication Interfaces | SPI, UART, GPIO, I2C, I2S, SD, PCM, SIM |
| Package Type | LFBGA |
| Dimensions | 13mm × 13mm × 3mm |
| Operating Temperature | -40℃ to +85℃ |