Overview of the BeiDou System and Chips

Since its establishment as a trial system in 2000, the BeiDou Satellite Navigation System has become the only global satellite system that combines navigation and short message communication functionalities. As core components of the system, BeiDou chips are responsible for receiving and solving satellite signals, directly influencing the performance of terminal applications. BeiDou signals cover the B1, B2, and B3 frequency bands, with BeiDou-3 introducing additional public service signals like B1C and B2a. The chip structure includes RF (Radio Frequency), baseband, and application parts. The RF section processes analog signals, while the baseband section handles signal decoding.

By 2020, the sales of domestically produced BeiDou-compatible chips and modules had surpassed 150 million units, with quarterly shipments exceeding 10 million units. The 28nm RF baseband integrated SoC chips supporting BeiDou-3 have been widely used in the IoT and consumer electronics sectors, while the 22nm dual-frequency dual-mode chips have entered mass production.

Classification and Applications of BeiDou Chips

BeiDou chips have led to the development of two types of board products: measurement-type (centimeter-level accuracy) and navigation-type (meter-level accuracy) boards. Measurement-type boards, which are more technically challenging, are mainly used in specialized fields, while navigation-type boards focus on real-time data processing and are cost-effective. Terminal products include both professional terminals (such as high-precision surveying and timing devices) and consumer terminals (such as vehicle navigation and wearable devices). The latter has a larger market size, and its growth is largely dependent on technological progress and cost reduction.

In 2020, the BeiDou industry market exceeded ¥400 billion. Major applications include smartphones (approximately ¥76.2 billion), passenger car navigation systems (about ¥50 billion), autonomous driving cockpits (around ¥13.5 billion), and vehicle monitoring (approximately ¥11.2 billion). BeiDou applications are divided into special markets (military, public security), industry markets (transportation, smart cities), and mass markets (navigation, social entertainment).

Top 10 BeiDou Chips

HeXing XingTong: NebulasIV UC9810
This 22nm RF baseband chip integrates high-precision algorithms and supports 1408 channels with full system and frequency point signals. It has a low power consumption of just 300mW, making it suitable for high-precision applications like drones and precision agriculture.

Haige BeiDou: Dolphin 3
Supporting the full functionality of BeiDou-3, this chip offers millimeter-level positioning accuracy and global short-message communication. It features multiple signal processing channels and strong anti-jamming capabilities, ideal for complex environments.

Guoke Micro: GK9501
This 40nm multi-mode navigation chip integrates RF front-end and power management, supporting various external interfaces. It’s designed for cost-effective positioning applications.

Huada BeiDou: HD9300
A full-system, full-frequency RTK centimeter-level chip that supports BeiDou-3 and dual-frequency BeiDou systems. It includes intelligent interference detection and is used in high-precision positioning applications.

Zhenxin Technology: GM4622
A dual-channel, multi-mode RF receiver chip that offers low power consumption and a small size. It supports BeiDou multi-frequency and anti-jamming functions, suitable for various RNSS terminals.

Mengxin Technology: Qimeng MXT2708A
This 40nm baseband and RF integrated chip supports multi-system joint positioning and anti-jamming technology, making it ideal for applications in transportation and consumer electronics.

Unigroup Zhanrui: Tianqin II Lyra
A 55nm baseband chip supporting 1100 channels and full BeiDou-3 signals. It has built-in anti-jamming technology and is used in high-precision applications like measurement and autonomous driving.

Dongfang Lianxing: OTrack-128
This chip integrates a multi-mode navigation engine and supports RDSS communication and high-dynamic applications. Its flexible packaging and strong anti-jamming ability make it suitable for various uses.

Wallisemi: HBP2012
Supporting multi-system combined positioning and short-message communication, this chip is capable of command functions and is ideal for high-dynamic and anti-jamming scenarios.

Taidou Microelectronics: TD1030
A 40nm baseband and RF integrated chip with automotive-grade certification. It supports multi-system positioning and combined navigation, suitable for automotive, wearable devices, and more.

Summary

The development of BeiDou chips has evolved from the early BM3002 to modern SoC architectures, with process technology improving from 0.35μm to 22nm. Power consumption and chip size have been significantly optimized. Current chips face challenges in sensitivity, anti-jamming, and communication capacity. However, future advancements will focus on forward error correction coding, multi-card integration, and global beam-switching technologies. As the BeiDou system expands globally, chip technology will continue to drive industry innovation and application growth.