BeiDou-2 Dedicated Baseband Processor Chip – Multi-GNSS Compatible with BGA Package
HBP2012
The HBP2012 is a specialized BeiDou-2 (BDS-2) baseband processor chip developed by WalliSemi, designed to deliver reliable navigation performance for critical applications. Fabricated using mature 55nm process technology, this robust IC supports multiple satellite navigation systems including BeiDou-2 (B1/B2/B3/S/L bands), GPS (L1), and GLONASS (F1).
Specifications
Key technical features:
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Multi-system compatibility for enhanced positioning reliability
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Compact BGA package (14×14×1.35mm) suitable for space-constrained designs
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Comprehensive interface options (UART, SPI, I2C, GPIO) for flexible system integration
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Wide operating temperature range (-40℃ to +85℃) for demanding environments
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Optimized for BeiDou-2 applications requiring stable and accurate positioning
This processor chip represents WalliSemi’s commitment to “Intelligent Technology, Core to the Future”, providing a cost-effective solution for navigation systems, timing devices, and location-based services that rely on BeiDou-2 infrastructure. Its balanced performance and proven technology make it particularly suitable for industrial and commercial applications where reliability is paramount.
| Model | HBP2012 |
| Supported Frequencies | BDS B1/B2/B3/S/L, GPS L1, GLONASS F1 |
| Process Technology | 55nm |
| Navigation & Communication Interfaces | UART, SPI, I2C, GPIO |
| Package Type | BGA |
| Dimensions | 14mm × 14mm × 1.35mm |
| Operating Temperature | -40℃ to +85℃ |