Industry Application Case Name: Advanced 3D-Integrated Photovoltaic Chip Power Supply Solution
Recently, a research team led by Professor Ye Tao at the School of Electromechanical Engineering successfully developed a high energy and power density photovoltaic chip power supply system, which was deployed in space aboard the “Xingjiyuan-1” satellite launched by the Lijian-1 Y7 carrier rocket at the Jiuquan Satellite Launch Center. This achievement represents a major breakthrough in spacecraft energy technology and provides critical support for the next generation of satellite applications.
The “Xingjiyuan-1” satellite serves as a new-generation multi-functional Earth observation platform, carrying an innovative photovoltaic chip power system, a space situational awareness module, and multispectral remote sensing payloads. Its mission is to deliver remote sensing support for diverse sectors such as power grid management, border security, environmental monitoring, smart agriculture, and forestry. Current downlink data confirms that all onboard modules are operating smoothly and fully meet the designed technical requirements.
During the system’s development, the research team addressed long-standing challenges in conventional spacecraft photovoltaic systems, including low integration, heavy weight, low energy and power density, and limited intelligence. They introduced a new technical architecture featuring long-lifetime charge/discharge regulation, high-efficiency dual-source/load matching control, integrated communication and energy management, and advanced single-chip 3D integration. This approach led to the successful creation of a high-density 3D integrated photovoltaic chip system. Compared to traditional solutions, the new system drastically reduces spacecraft energy subsystem weight, enhances energy efficiency, and overcomes key technical bottlenecks such as wafer-level submicron 3D interconnection, precise Boost circuit voltage regulation, and on-chip photovoltaic integration. Furthermore, it ensures stable power supply for optical imaging payloads during in-orbit operation.
Validated by both user organizations and third-party authorities, the system has been recognized as achieving internationally leading levels in energy density, power density, service lifetime, and intelligent control capabilities. The successful in-orbit demonstration not only confirms the system’s feasibility and technological superiority but also provides reliable full-lifecycle energy support for new-generation Earth observation spacecraft.
This milestone marks a significant leap in China’s space photovoltaic power technology. The deployment of the 3D-integrated chip power supply system paves the way for smarter, longer-lasting, and more scalable spacecraft, offering a robust foundation for future high-performance satellite missions and industry applications.
